Hybrid Bonding at Scale: Powering the Next Era of Semiconductor Packaging
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In our latest Market Brief, Hybrid Bonding at Scale: Powering the Next Era of Semiconductor Packaging , developed in partnership with Applied Materials, Futurum Research explores how hybrid bonding is transforming semiconductor manufacturing and enabling next-generation AI and HPC performance…
Futurum Research,
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The Futurum Group, "Hybrid Bonding at Scale: Powering the Next Era of Semiconductor Packaging," October 7, 2025. https://preview.erikbethke.com/research-reports/hybrid-bonding-at-scale-powering-the-next-era-of-semiconductor-packaging/
The semiconductor industry is entering a new era defined by the limits of transistor scaling and the rise of advanced packaging. As Moore’s Law slows, performance and efficiency gains now come from innovations in how chips are interconnected, integrated, and assembled. Hybrid bonding has emerged as a critical technology for enabling next-generation AI, HPC, and memory applications—driving lower power, higher bandwidth, and tighter coupling between compute and memory components.
To meet escalating compute demands, the industry needs breakthroughs in materials, process integration, and manufacturing scalability. Applied Materials’ leadership in advanced packaging and collaboration with Besi have produced the industry’s first fully integrated die-to-wafer hybrid bonding system. The Kinex™ platform consolidates every step of the bonding process to deliver higher yields, faster cycle times, and the reliability required for high-volume manufacturing in the AI era.
In our latest Market Brief, Hybrid Bonding at Scale: Powering the Next Era of Semiconductor Packaging, developed in partnership with Applied Materials, Futurum Research examines how hybrid bonding is reshaping semiconductor design and manufacturing. The report explores Applied’s integrated materials approach, the technical breakthroughs behind Kinex, and the long-term implications for chipmakers pursuing advanced logic, memory, and packaging integration.
In this brief, you will learn:
- Why advanced packaging and hybrid bonding are now the foundation of post-Moore’s Law scaling
- How Applied Materials and Besi’s Kinex™ platform integrates every step of die-to-wafer bonding
- The performance, yield, and productivity benefits enabled by integrated queue-time control and metrology
- Analyst insights into the market outlook and adoption curve for hybrid bonding through 2030
If you are interested in learning more, be sure to download your copy of Hybrid Bonding at Scale: Powering the Next Era of Semiconductor Packaging today.
Published by Futurum.